 |
|
|
|
 |
| Polyimide with silicone adhesive. Provides excellent chemical resistant and heat resistant, and wide selection of adhesion intensity. No residue leaves after peel off. |
|
|
 |
|
Technical DATA |
|
|
|
| Thickness |
Adhesion |
Tensile Strength |
Elongation |
Operating Temp |
| Various thicknesses |
650~1400 gf/25mm |
3.5~30 kgf/25mm |
40~70 % |
230℃ |
|
|
|
|
|
|
Typical Application |
|
|
|
- Masking for FPCB and semi-conductor
※ For detailed product specifications, please contact us. |
|
|
|
|
|
| |
|
